Umshini wokupakisha ozenzakalelayo

Umshini Wokupakisha Okuzenzakalelayo uklanyelwe ukusebenza kahle-okuphezulu, ukukhiqizwa kwebhethri ye-lithium{1}}enembile. Usebenzisa indlela yokugoqa engu-Z-ethuthukisiwe, umshini ushintshanisa kalula amashidi e-electrode ephozithivu nenegethivu namafilimu esihlukanisi, oqinisekisa ukuqondana kwesendlalelo esikhethekile kanye nobuqotho besakhiwo. Izici ezibalulekile zifaka i-servo-isistimu yokubamba irobhothi eshayelwa,-ukulawula ukungezwani kwesikhathi sangempela, kanye nokutholwa kogqinsi kwe-ultrasonic ukuze kuvinjelwe ukulandwa kabili kweshidi{7}}noma ukungahambi kahle. Ngesivinini sokupakisha esingaphansi noma esilingana namasekhondi angu-2.0 ucezu ngalunye nokunemba kokuqondanisa phakathi kuka-±0.5mm, lo mshini uqinisekisa ukusebenza okuphakeme nokuvumelana. Ilungele izindawo zegumbi elihlanzekile, isekela ubukhulu beselula obungenziwa ngokwezifiso futhi inikeza isilinganiso sesikhathi sokusebenza esingu-Greater noma esilingana no-98%. Phakamisa inqubo yakho yokukhiqiza ibhethri ngalesi sixazululo esinokwethenjelwa, esizenzakalelayo sokupakisha.

1.Izisetshenziswa nemingcele

Umdwebo we-adhesive tape

2.Izingxenye ezibalulekile

Ukwakheka nencazelo yesakhiwo sesistimu:

3.Ukwethulwa kwama-Ejensi

3.1 I-Rack Module:

Uhlelo luqukethe izingxenye ezintathu ezibalulekile: isakhiwo esikhulu sokubeka, ipuleti lokukhweza elijwayelekile, kanye neyunithi ye-HMI. Isakhiwo se-rack sinikeza ukwesekwa kwesakhiwo sayo yonke imishini. I-mounting plate, yakhiwe nge-steel plate engu-25mm-thick, isebenza njengendawo yokufaka ehlanganisiwe nendawo eyireferensi kwamanye amasistimu angaphansi. Iyunithi ye-HMI ilawula ukusebenza kwemishini.

3.2 Indlela yebhokisi le-electrode enhle/embi:

3.2.1 Ibhokisi lempahla linomsebenzi wokukhipha uthuli kanye -nokuvikela izingcezu eziningi.

3.2.1 Indawo yebhokisi lempahla ye-electrode ephozithivu nenegethivu kanye nendawo yetafula lokulungisa ihlukanisiwe ukusuka phansi kuye phezulu ukuze kuvinjelwe-ukungcoliswa okunqamulayo kwezinto zama-electrode eziphozithivu nezinegethivu.

3.3.2 Ukucushwa kwendawo ngayinye yokuma: Imbobo yokudonsa engu-1, ifeni e-1 yokukhipha uthuli okwabelwana ngayo ne-electrode eyinegethivu, futhi kusetshenziswa umtshina we-ultrasonic ongu-1 ukuze kutholwe ukuthi kukhona yini ishidi eliphindwe kabili le-electrode. I-alamu nokuvala shaqa kuzoqalwa uma kutholakala amashidi amaningi.

3.3.3 Iyunithi yokulungisa ifakwe imbobo yokudonsa uthuli kanye nefeni yokudonsa uthuli eceleni ukuze imunce uthuli oluwayo.

3.3.4 Inqubo yokumisa kanye ne-electrode plate transplanting ngeke ilimaze unqenqema lwepuleti le-electrode.

3.3.5 Ukunemba kokuma ± 0.1mm.

3.4 Indlela yokuphatha impahla yesandla umakhenikha:

3.4.1 I-manipulator iqhutshwa injini ye-servo ukuqinisekisa ukuphindaphinda kokunyakaza okuphindaphindiwe.

3.4.2 Isitimela se-hand hand rail kanye ne-screw rod zifakwe nesembozo sothuli esibalulekile ukuvikela uthuli ukuthi lungawi eshidini le-electrode.

3.4.3 I-electrode sheet manipulator ifakwe umsebenzi wokudlidliza. Uma ukutholwa kweshidi le-electrode kwehluleka, kungakhangwa futhi-. Uma imizamo eminingi ihluleka, i-alamu izokwazisa opharetha ngokuxazulula inkinga.

3.5 Indlela yokuvula i-diaphragm:

3.5.1 Ukungaqedwa kancane kwe-diaphragm: Ukuhlehlisa kancane, i-alamu yokushoda kwempahla uma impahla inganele.

3.5.2 Uhlelo lokulawula ukucindezeleka lulawula ukungezwani ngesikhathi sangempela ngokusebenzisa isilinda esicindezelayo esilungisekayo kanye nerola elintantayo, futhi uhla lokulawula lwe-diaphragm tension luyi-10-150N.

3.5.3 Wonke umshini wokuvula i-diaphragm ulayishwa endaweni yokulungisa. Inzwa yokulungisa inokunemba okungu-± 0.1mm, ukunemba kokubeka kwesistimu yokulungisa ngu-± 0.2mm, futhi ububanzi bokulungisa ± 20mm.

3.5.4 Idivaysi yokususa i-diaphragm electrostatic ifakwe ukuze kuvinjwe i-diaphragm ukuthi ingangcoliswa yi-dust electrostatic adsorption.

3.6 Indlela yesikhulumi sokugoqa esiyinhloko:

3.6.1 Isiteji sokupakisha silawulwa injini ukuze iphakamise futhi yehlise. Umshini wokuphakamisa ufakwe phakathi nendawo yesikhulumi sokupakisha, ukuze isiteji sokupakisha sibe ngaphansi kwamandla afanayo ngesikhathi sokucindezela. Lapho ukushuba kwe-stacking kukhula, iplathifomu yokunqwabelanisa iyehliswa kancane kancane ukuze kugcinwe ubude bokunqwabelanisa bungashintshile, futhi isivinini sokwehla seplathifomu yokupakisha singasethwa.

3.6.2 Ukucindezela komshini wokucindezela ithebhulethi kungalungiswa ukuze kuqinisekiswe ukuthi akukho monakalo ozodaleka ku-electrode plate kanye ne-diaphragm.

3.7 Indlela yokusika i-diaphragm:

3.7.1 Ukuhlanganiswa okushisayo-kuhlanganisa i-nickel yokushisisa{2}}i-chromium blade yokusika, okuqinisekisa ukushintshwa okulula.

3.7.2 Akukho ukuqhekeka, ukungqubuzana, ukudweba nezinye izenzakalo kulwelwesi ngemva kokusikwa.

3.7.3 Ukuphila kwe-blade yokusika izikhathi ezingaphezu kuka-100,000 (ishintshwa kanye ngenyanga).

3.8 Umshini wokusika umshini weselula:

Indlela yokusika impahla yefoni ephathekayo ibopha iseli kusuka etafuleni le-laminating kuya endaweni yokusika eshisayo, bese idlulisela iseli kumshini wokunamathisela wesenzo sokugoqa sokunamathela ngemuva kokuqedwa kokusika okushisayo.

3.9 Indlela yokunamathela:

3.9.1 Ngemva kokuqedwa kokusika okushisayo, sebenzisa ingalo yerobhothi ukuze ukhiphe iseli, ulifake esiteshini sokufaka iglue, bese usebenzisa i-pressure block ukuze ucindezele iseli kule nqubo.

Iseli ligcinwa lisesimweni esiboshiwe.

3.9.2 Iseli yebhethri iqiniswe ngaku-U-okunamathelayo okumise okuseceleni, itheyiphu iyisicaba, futhi i-diaphragm ayinayo imibimbi esobala.

3.9.3 Ubude bokunamathela bungalungiswa.

3.10 Indlela yokuphakela amaseli:

Isandla esibonakalayo sibeka iseli eliboshwe ngenjoloba endaweni yesikhulumi.

3.11 Ikhava yokuzivikela;

3.11.1 Ikhava yesisetshenziswa senziwa ngephrofayili ye-aluminium kanye nepuleti le-acrylic, elinesakhiwo esizinzile nokuvaleka kahle.

3.11.2 Zonke izicabha zekhava zifakelwe amaswishi okulawula ukungena, futhi okokusebenza kuyeka ukusebenza lapho umnyango uvulwa.

Izesekeli ze-4.Equipment

4.1 Imidwebo yesekethe kagesi (ilethwe nemishini).

4.2 Izingxenye ezijwayelekile kanye nethebula elikhulu lokumisa (Isithasiselo).

4.3 Uhlu lwezingxenye ezisengozini.

4.4 Uhlu lwezinto ezingahleliwe.